Improving the Dispersion Stability and Chemical Mechanical Polishing Performance of CeO<sub>2</sub> Slurries

نویسندگان

چکیده

The dispersion stability of CeO 2 suspensions limits their widespread use in IC manufacturing because unstable slurries can be very damaging to the chemical mechanical polishing (CMP) flattening process. Therefore, this study is based on wet ball milling synergy with agents improve slurry. Different organic acids were used as adjusting agents, including acetic acid, propionic lactic and phytic acid. characterization showed that, compared other acids, using acid a modest particle size distribution, good (zeta potential &gt; 50 mV), monodispersity (polydispersity index &lt; 0.1) higher activity (higher content Ce 3+ ). Moreover, CMP experiments that slurry agent had removal rate (4139 Å min −1

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ژورنال

عنوان ژورنال: ECS Journal of Solid State Science and Technology

سال: 2023

ISSN: ['2162-8769', '2162-8777']

DOI: https://doi.org/10.1149/2162-8777/accaa5